Bond Testing with the BondCheck

Multi-Mode Bond Testing.
Pitch-Catch, Resonance and MIA testing modes.

Multi-Mode Bond Testing.
Pitch-Catch, Resonance and MIA testing modes.

Multi-Mode Bond Testing.
Pitch-Catch, Resonance &
MIA testing modes.

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Danatronics

MTG99 

 

MTG-99

  • Measures the thickness of all non-ferrous materials .
  • Non-destructive measurement technology.
  • 0.00254 - 2.5 cms (0.001” -1”) thickness range.
  • Minimum thickness capture with vibrate on alarm
  • Datalogger with interface to Microsoft ExcelTM

 

Typical applications include:

  • Plastic bottles including multi-layer and containers
  • Titanium and Aluminium materials such as tubes and cans
  • Composite structures
  • Preforms
  • Microwave trays
  • Composites and FRP
  • Glass containers
  • Ceramics
  • Plastic toys

 Download the MTG-99 brochure 

The MTG 99 offers an expanded list of target options to greatly extend its measurement capability.

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